WIRE BONDING IN MICROELECTRONICS, 3/E; George Harman; 2010

WIRE BONDING IN MICROELECTRONICS, 3/E Upplaga 3

av George Harman
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The Industry Standard Guide to Wire Bonding--Fully Updated
the definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation cd includes all of the book's full-color figures plus animations.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The Industry Standard Guide to Wire Bonding--Fully Updated
the definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation cd includes all of the book's full-color figures plus animations.
Upplaga: 3e upplagan
Utgiven: 2010
ISBN: 9780071476232
Förlag: McGraw Hill
Format: Inbunden
Språk: Engelska
Sidor: 446 st
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The Industry Standard Guide to Wire Bonding--Fully Updated
the definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation cd includes all of the book's full-color figures plus animations.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The Industry Standard Guide to Wire Bonding--Fully Updated
the definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation cd includes all of the book's full-color figures plus animations.
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Om WIRE BONDING IN MICROELECTRONICS, 3/E (2010)

I mars 2010 släpptes boken WIRE BONDING IN MICROELECTRONICS, 3/E skriven av George Harman. Det är den 3e upplagan av kursboken. Den är skriven på engelska och består av 446 sidor djupgående information. Förlaget bakom boken är McGraw Hill.

Köp boken WIRE BONDING IN MICROELECTRONICS, 3/E direkt från en annan student på Studentapan och spara pengar.

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